Electroplating is one of the most challenging process steps for tsv fabrication The primary objective of the annealing process for soft magnetic alloys is to minimize the defects that generate residual stress in the material, thereby optimizing the magnetic properties. 200mm 3 integrated frame with at least two (2) plating modules and phase 3 anode chamber
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The sabre next (nano era xt) builds on the sabre xt’s production track record, offering a proprietary, single step chemistry, a new anode cell design, and other hardware refinements to tackle the complex process requirements of 90 nanometer, 65 nanometer and 45 nanometer interconnect structures.
For the numerous materials and demanding features involved, lam’s thin film deposition products provide the precision, performance, and flexibility needed for a wide range of challenging device applications.
